Skip to content
← Back to Resources

PROCESS CONTROL · BATCH UNIFORMITY

Feed position-dependent batch variation into the next recipe

WHY IT MATTERS

Batch equipment already has sophisticated zone control

Diffusion, oxidation, anneal and LPCVD processes in semiconductor and solar manufacturing widely use batch furnaces that process many wafers at once. Modern systems use multi-zone heaters and sophisticated thermal control to improve both throughput and uniformity.

For example, Tokyo Electron's 300 mm batch thermal system processes up to 200 wafers with multi-zone control heaters, while JTEKT Thermo Systems offers horizontal furnaces for solar-cell production that process 200–400 wafers per batch.

Even when equipment can control multiple zones independently, the optimal zone recipe for the desired batch result does not determine itself.

Results differ by position within the same batch

Wafers at the top, middle and bottom of a boat experience different thermal histories. What ultimately matters is not furnace temperature alone, but variation in the wafer result by position.

TOP wafersMIDDLE wafersBOTTOM wafers
Target uniformityReduce position-dependent variation
and bring the full boat into target

More zones make manual tuning more complex

Engineers inspect measured results, change heater-zone setpoints and run another batch. Zones influence one another, and the best conditions change with product and recipe, so testing repeats.

EQUIPMENT

Control multiple zones independently

Use equipment variables such as heating zones, gas, pressure and time to adjust process conditions.

→
AMFIBIAN

Calculate the conditions required for the target result

Connect position-dependent outcomes with control variables, calculate the zone recipe required for target uniformity, and review the expected result before application.

Use the batch result to adjust the next recipe

Amfibian models the relationship between position-dependent batch outcomes and zone conditions. When the target or product changes, it recalculates the recipe for the new target and applies it to the next run after validation.

Conventional manual tuning

01
Run batch

Process the wafer boat with the current recipe.

02
Review results by position

Check variation at the top, middle and bottom.

03
Change zone conditions

An engineer adjusts conditions from measurements and experience.

04
Run again and repeat

Repeat batch runs and measurements until the target is reached.

Requires equipment time and repeated trials

Amfibian

01
Input batch profile

Use position-dependent measurements and process data.

02
Calculate zone recipe

Calculate the conditions required for target uniformity.

03
Validate before application

Check expected results and process/equipment constraints.

04
Apply to the next batch

Move to production under the customer's approval procedure.

Reduces repetitive zone-tuning steps

Applicable to semiconductor and solar batch thermal processes

Even with the same batch furnace, actuators, metrology and controlled outcomes differ by equipment and industry. Amfibian defines the modeling and validation scope around the variables the equipment can actually adjust and the quality outcomes that matter.

SEMICONDUCTOR

Diffusion · Anneal · Batch Deposition

Manage variation in film, dopant and thermal-process results by wafer position in the boat and adjust the next batch's zone conditions.

View semiconductor use cases →
SOLAR / PV

Diffusion · Oxidation · Thermal Process

Manage position-dependent variation in PV furnaces processing large wafer batches and adjust the zone recipe to product conditions.

View solar use cases →

Public examples of batch-equipment control

Equipment vendors emphasize multi-zone thermal control and temperature uniformity as well as throughput. Amfibian uses those existing control capabilities and adds a software layer that calculates zone conditions from actual wafer results.