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Industries

Built for precision manufacturing processes that require predicting outcomes and continuously adjusting production conditions.

Semiconductor Manufacturing

Connect metrology, prediction and control across repeating processes like CMP, CVD, Etch and Cleaning to reduce variation and optimize conditions.

CMP

Estimate removal and thickness,
then calculate the next wafer conditions

Estimate results for unmeasured wafers and calculate polishing time or recipe from the target and previous result. Zone-level conditions can also be adjusted to control profile.

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CVD · Deposition

Estimate film outcomes and compensate
the next run as the process drifts

Estimate unmeasured results from process and equipment data. Chamber and consumable changes, along with target values, can also feed into calculating the next run's conditions.

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Etch

Use process signals to assess state
and feed the result into the next run

Estimate results from OES and other process signals plus equipment data, and reflect any gap from target in the next process conditions.

Cleaning

Operate recurring processes while
accounting for product and tool differences

Model results by combining upstream state and equipment data, and set operating criteria for each product and tool.

Power & Compound Semiconductors

Manage equipment and chamber state alongside product variation in highly sensitive processes like SiC and GaN.

Photonics & Optoelectronics

Fill metrology gaps and keep process conditions stable across thin-film deposition, etch and optical-property measurement.

MEMS & Sensors

Run models and control policies for high-mix sensor and MEMS processes, reflecting each product's conditions and equipment state.

Advanced Packaging

Connect metrology and process results across advanced packaging steps like bonding, CMP and plating to automate repeated corrections.

Display & Microdisplay

Manage spatial uniformity and process drift across thin-film, etch and deposition-based display manufacturing.

Solar &
Photovoltaics

Connect process state and quality in solar cell manufacturing that uses semiconductor-like processes such as HJT, tandem, thin-film and perovskite.

Batch Furnace

Model boat and position differences
to reduce within-batch variation

Model position-to-position differences within a batch and adjust zone or position conditions to reduce variation between products.

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Thin-film · Deposition

Estimate unmeasured results and compensate conditions as chamber state changes

Estimate results for unmeasured substrates and adjust the next run or batch conditions to match chamber state and product conditions.

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